EAP
(Equipment Automation Process) allows the CIM (Computer
Integration Manufacturing) system to control processing
of equipment to minimize or eliminate mis-processing due
to operator error. EAP connected to semiconductor manufacturing
devices that control the operation and management of those
devices. The program running on each computer includes
the driver which control equipment, communication interfaces
to each other applications and host systems and the business
logic that interact with these components
by defined sequences. Our EAP solutions and services provide
our clients the following benefits:
Save operator data keystrokes
and Avoid human errors
Automatically Step Control
Automatically PPID
( Process Program Identification ) selections and
verification
Automatically Engineering Data
Collection
Equipment alarm notification
Event report and logging
CIT EAP Consulting Services
Choosing a CIT Automation solution
for your EAP control system includes access to a highly
experienced pool of professionals ready to provide project
services and on-going support. CIT Automation Solution
has developed the Control Service suite of Project Consulting
and Customer Support services to ensure that our clients
are able to maximize the benefits of CIT Automation solutions
in development and production environments.
Tools
and Technologies
Our Toolsets and components
are written as Windows applications and COM DLLs wherever
possible.
Equipment Integration
Tools
Brooks Automation
Grapheq, Cellwork
WINSECS, StationWorks
PRI Automation
FABuilder
Message BUS
DMBX
TIBCO Object Bus
TIBCO Rendezvous
IBM MQ-Series
Services
offering
CIT's EAP professionals provide our
clients design, development and deployment of the
following consulting services:
Object Oriented and Distributed Computing
Architecture
Scalable System Design
Application Upgrade and Deployment
Equipment Automation Startup and Shutdown
Management
Automated Data Collection
Advance Process Control (APC)
Control Mode Management
Moving from 200mm to 300mm
Early in year 2000, we re-invented our EAP tool set
and services from 200mm to 300mm to meet 300mm SEMI-standards
and clients specific process requirements.
Fully-automated AMHS ( Automatic Material Handling
System ) and dispatching integration
Single wafer processing and wafer group processing
(as opposed to lot processing)
Implement for next generation 300mm MES (Manufacturing
Execution System) and SEMI standards
Engage with OEE (Overall Equipment Effectiveness)
through accurate state change control
"Run" based and "Time" based
(trace) data collection with dynamic setup capabilities
- for both process and metrology equipments
Wafer level tracking and slot map reporting
Feedforward, feedback APC, and "Run" to
"Run" control
Integrate with the material auto-ID and operator
auto-ID systems
Provide configurable action plans to be executed
upon exception detection
